Publication
IEE Colloquium on Assembly and Connections in Microsystems
Record type
Proceedings article
Published
1997
Authors
P.A. Payne
DOI

The publisher of this work supports multiple resolution. The work is available from the following locations:

debug {'doi': '10.1049/ic:19970029', 'member_id': '265', 'member': 'IEE', 'container-title': 'IEE Colloquium on Assembly and Connections in Microsystems', 'primary-resource': 'https://digital-library.theiet.org/content/conferences/10.1049/ic_19970029', 'tld': 'theiet.org', 'clearbit-logo': 'https://logo.clearbit.com/theiet.org', 'coaccess': [], 'multiple-resolution': [{'url': 'http://ieeexplore.ieee.org/lpdocs/epic03/wrapper.htm?arnumber=597352', 'tld': 'ieee.org', 'clearbit-logo': 'https://logo.clearbit.com/ieee.org'}], 'type': 'PROCEEDINGS ARTICLE', 'published_date': '1997', 'publication': 'IEE Colloquium on Assembly and Connections in Microsystems', 'title': 'Microsensors research at UMIST', 'name': None, 'id': None, 'location': None, 'display_doi': 'https://doi.org/10.1049/ic:19970029', 'grant_info': None, 'grant_info_funders': None, 'grant_info_funder_ids': '', 'grant_info_type': None, 'multiple_lead_investigators': [], 'multiple_co_lead_investigators': [], 'multiple_investigators': [], 'finances': [], 'project_description': None, 'award_amount': None, 'award_start': None, 'funding_scheme': None, 'internal_award_number': None, 'editors': None, 'authors': 'P.A. Payne', 'chairs': None, 'supplementary_ids': None}
https://doi.org/10.1049/ic:19970029
JSON
XML