Temperature estimation of semiconductor die heating using numerical techniques in real time

Publication
IEE Colloquium on Modelling and Simulation for Thermal Management
Record type
Proceedings article
Published
1997
Authors
K.P. Thomas
DOI
https://doi.org/10.1049/ic:19970271
The publisher of this work supports multiple resolution. The work is available from the following locations:
theiet.org
ieee.org

debug {'doi': '10.1049/ic:19970271', 'member_id': '265', 'member': 'IEE', 'container-title': 'IEE Colloquium on Modelling and Simulation for Thermal Management', 'primary-resource': 'https://digital-library.theiet.org/content/conferences/10.1049/ic_19970271', 'tld': 'theiet.org', 'clearbit-logo': 'https://logo.clearbit.com/theiet.org', 'coaccess': [], 'multiple-resolution': [{'url': 'http://ieeexplore.ieee.org/lpdocs/epic03/wrapper.htm?arnumber=668301', 'tld': 'ieee.org', 'clearbit-logo': 'https://logo.clearbit.com/ieee.org'}], 'type': 'PROCEEDINGS ARTICLE', 'published_date': '1997', 'publication': 'IEE Colloquium on Modelling and Simulation for Thermal Management', 'title': 'Temperature estimation of semiconductor die heating using numerical techniques in real time', 'name': None, 'id': None, 'location': None, 'display_doi': 'https://doi.org/10.1049/ic:19970271', 'grant_info': None, 'grant_info_funders': None, 'grant_info_funder_ids': '', 'grant_info_type': None, 'multiple_lead_investigators': [], 'multiple_co_lead_investigators': [], 'multiple_investigators': [], 'finances': [], 'project_description': None, 'award_amount': None, 'award_start': None, 'funding_scheme': None, 'internal_award_number': None, 'editors': None, 'authors': 'K.P. Thomas', 'chairs': None, 'supplementary_ids': None}
https://doi.org/10.1049/ic:19970271
JSON
XML