Publication
Chinese Journal of Mechanical Engineering
Record type
Journal article
Published
2011
Authors
Songbai XUE
DOI

The publisher of this work supports multiple resolution. The work is available from the following locations:

debug {'doi': '10.3901/cjme.2011.05.917', 'member_id': '2265', 'member': 'Chinese Journal of Mechanical Engineering', 'container-title': 'Chinese Journal of Mechanical Engineering', 'primary-resource': 'http://www.cjmenet.com/xuebaoenglish/papersed/allpapered/abstractall/zyy2011_5_917.htm', 'tld': 'cjmenet.com', 'clearbit-logo': '/static/no_logo.svg', 'coaccess': [], 'multiple-resolution': [{'url': 'http://www.cjmenet.com.cn/xuebaoenglish/papersed/allpapered/abstractall/zyy2011_5_917.htm', 'tld': 'cjmenet.com.cn', 'clearbit-logo': '/static/no_logo.svg'}], 'type': 'JOURNAL ARTICLE', 'published_date': '2011', 'publication': 'Chinese Journal of Mechanical Engineering', 'title': 'Diode Laser Soldering Technology of Fine Pitch QFP Devices', 'name': None, 'id': None, 'location': None, 'display_doi': 'https://doi.org/10.3901/cjme.2011.05.917', 'grant_info': None, 'grant_info_funders': None, 'grant_info_funder_ids': '', 'grant_info_type': None, 'multiple_lead_investigators': [], 'multiple_co_lead_investigators': [], 'multiple_investigators': [], 'finances': [], 'project_description': None, 'award_amount': None, 'award_start': None, 'funding_scheme': None, 'internal_award_number': None, 'editors': None, 'authors': 'Songbai XUE', 'chairs': None, 'supplementary_ids': None}
https://doi.org/10.3901/cjme.2011.05.917
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